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Electrodeposition for die-to-wafer very high-density interconnect

dc.contributor.authorInoue, Fumihiro
dc.date.accessioned2021-10-28T22:45:56Z
dc.date.available2021-10-28T22:45:56Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35305
dc.sourceIIOimport
dc.titleElectrodeposition for die-to-wafer very high-density interconnect
dc.typeMeeting abstract
dc.contributor.imecauthorInoue, Fumihiro
dc.source.peerreviewyes
dc.source.beginpage1786
dc.source.conferencePRiME2020. Symposium G05: Materials and Processes for Semiconductor, 2.5 and 3D, Chip Packaging, PCB, FPCB and Wafer Bonding 3
dc.source.conferencedate4/10/2020
dc.source.conferencelocationVirtual Virtual
dc.identifier.urlhttps://iopscience.iop.org/article/10.1149/MA2020-02251786mtgabs
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts, Volume MA2020-02


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