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Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPodpod, Arnita
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorUedono, Akira
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-28T22:46:48Z
dc.date.available2021-10-28T22:46:48Z
dc.date.issued2020
dc.identifier.issn1525-6125
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35307
dc.sourceIIOimport
dc.titleMorphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage811
dc.source.endpage818
dc.source.journalJournal of Manufacturing Processes
dc.source.volume58
dc.identifier.urlhttps://doi.org/10.1016/j.jmapro.2020.08.050
imec.availabilityPublished - imec


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