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Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
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Authors
Inoue, Fumihiro
;
Podpod, Arnita
;
Peng, Lan
;
Phommahaxay, Alain
;
Rebibis, Kenneth June
;
Uedono, Akira
;
Beyne, Eric
ISSN
1525-6125
Journal
Journal of Manufacturing Processes
Volume
58
Title
Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
Publication type
Journal article
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