Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

dc.contributor.author	Inoue, Fumihiro
dc.contributor.author	Podpod, Arnita
dc.contributor.author	Peng, Lan
dc.contributor.author	Phommahaxay, Alain
dc.contributor.author	Rebibis, Kenneth June
dc.contributor.author	Uedono, Akira
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Inoue, Fumihiro
dc.contributor.imecauthor	Podpod, Arnita
dc.contributor.imecauthor	Peng, Lan
dc.contributor.imecauthor	Phommahaxay, Alain
dc.contributor.imecauthor	Rebibis, Kenneth June
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Peng, Lan::0000-0003-1824-126X
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-28T22:46:48Z
dc.date.available	2021-10-28T22:46:48Z
dc.date.issued	2020
dc.identifier.issn	1525-6125
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/35307
dc.identifier.url	https://doi.org/10.1016/j.jmapro.2020.08.050
dc.source.beginpage	811
dc.source.endpage	818
dc.source.journal	Journal of Manufacturing Processes
dc.source.volume	58
dc.title	Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
dc.type	Journal article
dspace.entity.type	Publication
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