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Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration

dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-28T22:50:24Z
dc.date.available2021-10-28T22:50:24Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35316
dc.sourceIIOimport
dc.titleFault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration
dc.typeProceedings paper
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceInternational Symposium for Testing and Failure Analysis (ISTFA2020)
dc.source.conferencedate7/12/2020
dc.source.conferencelocationVirtual workshop Virtual workshop
dc.identifier.urlhttps://asm.confex.com/asm/istfa20/webprogram/Paper51531.html
imec.availabilityPublished - imec


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