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Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects

dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorLi, Yunlong
dc.contributor.authorStucchi, Michele
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-28T22:50:49Z
dc.date.available2021-10-28T22:50:49Z
dc.date.issued2020
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35317
dc.sourceIIOimport
dc.titleOptical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects
dc.typeJournal article
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1542
dc.source.endpage1551
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue9
dc.source.volume10
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9157942
imec.availabilityPublished - imec


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