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Scaling and monolithic integration of organic and Hybrid electronic by advanced photolithography

dc.contributor.authorKe, Tung Huei
dc.contributor.authorMalinowski, Pawel
dc.contributor.authorRolin, Cedric
dc.contributor.authorCheyns, David
dc.contributor.authorGenoe, Jan
dc.contributor.authorKroneneijer, Auke
dc.contributor.authorAkkerman, Hylke
dc.contributor.authorMeulenkamp, Eric
dc.contributor.authorHeremans, Paul
dc.date.accessioned2021-10-28T23:10:52Z
dc.date.available2021-10-28T23:10:52Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35367
dc.sourceIIOimport
dc.titleScaling and monolithic integration of organic and Hybrid electronic by advanced photolithography
dc.typeProceedings paper
dc.contributor.imecauthorKe, Tung Huei
dc.contributor.imecauthorMalinowski, Pawel
dc.contributor.imecauthorRolin, Cedric
dc.contributor.imecauthorCheyns, David
dc.contributor.imecauthorGenoe, Jan
dc.contributor.imecauthorAkkerman, Hylke
dc.contributor.imecauthorHeremans, Paul
dc.contributor.orcidimecKe, Tung Huei::0000-0001-8381-4998
dc.contributor.orcidimecMalinowski, Pawel::0000-0002-2934-470X
dc.contributor.orcidimecCheyns, David::0000-0002-1327-8752
dc.contributor.orcidimecGenoe, Jan::0000-0002-4019-5979
dc.contributor.orcidimecHeremans, Paul::0000-0003-2151-1718
dc.source.peerreviewyes
dc.source.conferenceSID China Spring On-line Technical Meeting
dc.source.conferencedate9/05/2020
dc.source.conferencelocationvirtual conference china
imec.availabilityPublished - imec


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