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Mechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stack

dc.contributor.authorLofrano, Melina
dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-29T00:09:31Z
dc.date.available2021-10-29T00:09:31Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35500
dc.sourceIIOimport
dc.titleMechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stack
dc.typeProceedings paper
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceimaps MiNaPAD2020
dc.source.conferencedate27/05/2020
dc.source.conferencelocationvirtual virtual
imec.availabilityPublished - imec


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