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Cleaning and etching solutions for the prospective use of Molybdenum in next generation interconnect fabrication.

dc.contributor.authorPacco, Antoine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorAltamirano Sanchez, Efrain
dc.date.accessioned2021-10-29T01:45:48Z
dc.date.available2021-10-29T01:45:48Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35695
dc.sourceIIOimport
dc.titleCleaning and etching solutions for the prospective use of Molybdenum in next generation interconnect fabrication.
dc.typeMeeting abstract
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewyes
dc.source.beginpageS8.3
dc.source.conference29th Materials for Advanced Metallization (MAM) Conference
dc.source.conferencedate22/03/2020
dc.source.conferencelocationOnline Online
dc.identifier.urlhttps://www.web-events.net/doc/users/840/bib/globalprogramvf.pdf
imec.availabilityPublished - imec


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