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Thickness scaling of NiAl thin films for alternative interconnect metallization

dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorSwerts, Johan
dc.contributor.authorAdelmann, Christoph
dc.date.accessioned2021-10-29T04:37:14Z
dc.date.available2021-10-29T04:37:14Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35995
dc.sourceIIOimport
dc.titleThickness scaling of NiAl thin films for alternative interconnect metallization
dc.typeProceedings paper
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage151
dc.source.endpage153
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate5/10/2020
dc.source.conferencelocationVirtual USA
imec.availabilityPublished - open access


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