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New plating path for electroless copper deposition on sputtered barrier layers

dc.contributor.authorLantasov, Yuri
dc.contributor.authorMin, Woo Sig
dc.contributor.authorPalmans, Roger
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T11:41:09Z
dc.date.available2021-10-06T11:41:09Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3609
dc.sourceIIOimport
dc.titleNew plating path for electroless copper deposition on sputtered barrier layers
dc.typeOral presentation
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.conferenceEuropean Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.
imec.availabilityPublished - imec


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