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Copper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin

dc.contributor.authorLemaire, J. J.
dc.contributor.authorRajagopal, A.
dc.contributor.authorGregoire, C.
dc.contributor.authorPireaux, J. J.
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.authorWaeterloos, Joost
dc.date.accessioned2021-10-14T11:29:33Z
dc.date.available2021-10-14T11:29:33Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3614
dc.sourceIIOimport
dc.titleCopper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin
dc.typeMeeting abstract
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage738
dc.source.conference196th Meeting of the Electrochemical Society: Interconnects and Contact Metallization for ULSI
dc.source.conferencedate17/10/1999
dc.source.conferencelocationHonolulu, HI USA
imec.availabilityPublished - open access
imec.internalnotesMeeting Abstracts; Vol. 99-2


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