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Intra-field etch induced overlay penalties

dc.contributor.authorvan Haren, Richard
dc.contributor.authorYildirim, Oktay
dc.contributor.authorMouraille, Orion
dc.contributor.authorvan Dijk, Leon
dc.contributor.authorKumar, Kaushik
dc.contributor.authorFeurprier, Yannick
dc.contributor.authorHermans, Jan
dc.date.accessioned2021-10-29T06:14:00Z
dc.date.available2021-10-29T06:14:00Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36153
dc.sourceIIOimport
dc.titleIntra-field etch induced overlay penalties
dc.typeProceedings paper
dc.contributor.imecauthorvan Haren, Richard
dc.contributor.imecauthorYildirim, Oktay
dc.contributor.imecauthorKumar, Kaushik
dc.contributor.imecauthorFeurprier, Yannick
dc.contributor.imecauthorHermans, Jan
dc.contributor.orcidimecHermans, Jan::0000-0003-1249-8902
dc.source.peerreviewyes
dc.source.beginpage1132910
dc.source.conferenceAdvanced Etch Technology for Nanopatterning IX
dc.source.conferencedate23/02/2020
dc.source.conferencelocationSan Jose USA
dc.identifier.urlhttps://doi.org/10.1117/12.2552051
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 11329


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