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Analyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry

dc.contributor.authorLi, H.
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorBoullart, Werner
dc.contributor.authorConard, Thierry
dc.contributor.authorBrijs, Bert
dc.contributor.authorMaex, Karen
dc.contributor.authorFroyen, L.
dc.date.accessioned2021-10-14T11:29:35Z
dc.date.available2021-10-14T11:29:35Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3617
dc.sourceIIOimport
dc.titleAnalyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry
dc.typeJournal article
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewno
dc.source.beginpage3843
dc.source.endpage3851
dc.source.journalJ. Electrochem. Soc.
dc.source.issue10
dc.source.volume146
imec.availabilityPublished - imec


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