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Conference contributions
Improving the QFN Board level Reliability using Low Melting LMPAQ Solder
Publication:
Improving the QFN Board level Reliability using Low Melting LMPAQ Solder
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Date
2020
Proceedings Paper
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47082.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Labie, Riet
;
Lauwaert, R.
;
Telizsewski, S.
;
Werkhoven, D.
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Acq. date: 2025-12-11
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Metrics
Views
1856
since deposited on 2021-10-29
3
last month
Acq. date: 2025-12-11
Citations