Improving the QFN Board level Reliability using Low Melting LMPAQ Solder

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Authors
Vandevelde, Bart; Labie, Riet; Lauwaert, R.; Telizsewski, S.; Werkhoven, D.
Conference
IEEE Reliability for Electronics and Photonics Packaging Symposium - REPP
Title
Improving the QFN Board level Reliability using Low Melting LMPAQ Solder
Publication type
Proceedings paper
Embargo date
9999-12-31
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