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Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2

dc.contributor.authorLi, Hua
dc.contributor.authorHeyvaert, Ilse
dc.contributor.authorSing, Jin
dc.contributor.authorLanckmans, Filip
dc.contributor.authorBrijs, Bert
dc.contributor.authorBender, Hugo
dc.contributor.authorMaex, Karen
dc.contributor.authorFroyen, L.
dc.date.accessioned2021-10-14T11:29:37Z
dc.date.available2021-10-14T11:29:37Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3620
dc.sourceIIOimport
dc.titleCharacterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
dc.typeProceedings paper
dc.contributor.imecauthorHeyvaert, Ilse
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage297
dc.source.endpage303
dc.source.conferenceAdvanced Metallization Conference in 1998 - AMC 1998
dc.source.conferencedate6/10/1998
dc.source.conferencelocationColorado Springs, CO USA
imec.availabilityPublished - open access


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