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Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients

dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-29T08:47:15Z
dc.date.available2021-10-29T08:47:15Z
dc.date.issued2020
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36389
dc.sourceIIOimport
dc.titleModelling stress evolution and voiding in copper nano-interconnect under thermal gradients
dc.typeJournal article
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.identifier.doi10.1016/j.microrel.2020.113769
dc.source.peerreviewyes
dc.source.beginpage113769
dc.source.journalMicroelectronics Reliability
dc.source.volume111
imec.availabilityPublished - imec


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