Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients

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Authors
Zahedmanesh, Houman; Croes, Kristof
DOI
10.1016/j.microrel.2020.113769
ISSN
0026-2714
Journal
Microelectronics Reliability
Volume
111
Title
Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients
Publication type
Journal article
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