Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients

dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Croes, Kristof
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.date.accessioned	2021-10-29T08:47:15Z
dc.date.available	2021-10-29T08:47:15Z
dc.date.issued	2020
dc.identifier.doi	10.1016/j.microrel.2020.113769
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/36389
dc.source.beginpage	113769
dc.source.journal	Microelectronics Reliability
dc.source.volume	111
dc.title	Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients
dc.type	Journal article
dspace.entity.type	Publication
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