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Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection

dc.contributor.authorZheng, Li
dc.contributor.authorWang, C.
dc.contributor.authorCai, D.
dc.contributor.authorHuang, Y.
dc.contributor.authorAdi, K.
dc.contributor.authorHong, Y.
dc.contributor.authorChen, Y.
dc.contributor.authorZhou, G.
dc.contributor.authorArmini, Silvia
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorWang, Shouxu
dc.contributor.authorHe, Wei
dc.date.accessioned2021-10-29T09:02:00Z
dc.date.available2021-10-29T09:02:00Z
dc.date.issued2020
dc.identifier.issn1867-1070
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36411
dc.sourceIIOimport
dc.titleHydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.source.peerreviewyes
dc.source.beginpage130
dc.source.endpage136
dc.source.journalJournal of the Taiwan Institute of Chemical Engineers
dc.source.volume112
dc.identifier.urlhttps://doi.org/10.1016/j.jtice.2020.07.004
imec.availabilityPublished - imec


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