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Circuit modelling of high-density electronic packaging

dc.contributor.authorMartens, Luc
dc.date.accessioned2021-10-14T11:30:06Z
dc.date.available2021-10-14T11:30:06Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3652
dc.sourceIIOimport
dc.titleCircuit modelling of high-density electronic packaging
dc.typeProceedings paper
dc.contributor.imecauthorMartens, Luc
dc.contributor.orcidimecMartens, Luc::0000-0001-9948-9157
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage551
dc.source.endpage554
dc.source.conferenceProceedings of the European Conference on Circuit Theory and Design - ECCTD
dc.source.conferencedate29/08/1999
dc.source.conferencelocationStresa Italy
imec.availabilityPublished - open access


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