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The formation of Pd seeded copper layer on TiN substrates by electroless deposition

dc.contributor.authorMin, Woo Sig
dc.contributor.authorLantasov, Yuri
dc.contributor.authorPalmans, Roger
dc.contributor.authorMaex, Karen
dc.contributor.authorDong, Nyung Lee
dc.date.accessioned2021-10-14T11:30:56Z
dc.date.available2021-10-14T11:30:56Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3681
dc.sourceIIOimport
dc.titleThe formation of Pd seeded copper layer on TiN substrates by electroless deposition
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage65
dc.source.endpage71
dc.source.conferenceAdvanced Metallization Conference in 1998 - AMC 1998
dc.source.conferencedate6/10/1998
dc.source.conferencelocationColorado Springs, CO USA
imec.availabilityPublished - open access


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