The formation of Pd seeded copper layer on TiN substrates by electroless deposition
dc.contributor.author | Min, Woo Sig | |
dc.contributor.author | Lantasov, Yuri | |
dc.contributor.author | Palmans, Roger | |
dc.contributor.author | Maex, Karen | |
dc.contributor.author | Dong, Nyung Lee | |
dc.date.accessioned | 2021-10-14T11:30:56Z | |
dc.date.available | 2021-10-14T11:30:56Z | |
dc.date.issued | 1999 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3681 | |
dc.source | IIOimport | |
dc.title | The formation of Pd seeded copper layer on TiN substrates by electroless deposition | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Maex, Karen | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 65 | |
dc.source.endpage | 71 | |
dc.source.conference | Advanced Metallization Conference in 1998 - AMC 1998 | |
dc.source.conferencedate | 6/10/1998 | |
dc.source.conferencelocation | Colorado Springs, CO USA | |
imec.availability | Published - open access |