Mixed component integration in advanced printed wiring boards
dc.contributor.author | O'Reilly, S. | |
dc.contributor.author | Duffy, M. | |
dc.contributor.author | Mathuna, S. C. | |
dc.contributor.author | Raedschelders, E. | |
dc.contributor.author | Corlatan, D. | |
dc.contributor.author | Madou, An | |
dc.contributor.author | Martens, Luc | |
dc.contributor.author | Payne, S. | |
dc.date.accessioned | 2021-10-14T11:33:23Z | |
dc.date.available | 2021-10-14T11:33:23Z | |
dc.date.issued | 1999 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3738 | |
dc.source | IIOimport | |
dc.title | Mixed component integration in advanced printed wiring boards | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Martens, Luc | |
dc.contributor.orcidimec | Martens, Luc::0000-0001-9948-9157 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.conference | EC-MCM - The 5th European Conference on MultiChip Modules | |
dc.source.conferencedate | 1/02/1999 | |
dc.source.conferencelocation | London UK | |
imec.availability | Published - open access |