dc.contributor.author | Iacovo, Serena | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Nagano, Fuya | |
dc.contributor.author | Uhrmann, Thomas | |
dc.contributor.author | Burggraf, Jurgen | |
dc.contributor.author | Fehkuhrer, Andreas | |
dc.contributor.author | Conard, Thierry | |
dc.contributor.author | Inoue, Fumihiro | |
dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | De Vos, Joeri | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2022-04-25T09:54:50Z | |
dc.date.available | 2021-11-02T15:55:03Z | |
dc.date.available | 2022-04-01T15:11:22Z | |
dc.date.available | 2022-04-25T09:54:50Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000702282700317 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37432.3 | |
dc.source | WOS | |
dc.title | Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding | |
dc.type | Proceedings paper | |
dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.contributor.orcidimec | Conard, Thierry::0000-0002-4298-5851 | |
dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.identifier.doi | 10.1109/ECTC32696.2021.00330 | |
dc.identifier.eisbn | 978-0-7381-4523-5 | |
dc.source.numberofpages | 8 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2097 | |
dc.source.endpage | 2104 | |
dc.source.conference | IEEE 71st Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | JUN 01-JUL 04, 2021 | |
dc.source.conferencelocation | virtual | |
dc.source.journal | na | |
imec.availability | Published - open access | |