Notice
This item has not yet been validated by imec staff.
Notice
This is not the latest version of this item. The latest version can be found at: https://imec-publications.be/handle/20.500.12860/37681.3
Reliability of Mo as Word Line Metal in 3D NAND
dc.contributor.author | Tierno, Davide | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Ajaykumar, Arjun | |
dc.contributor.author | Ramesh, Siva | |
dc.contributor.author | Van den Bosch, Geert | |
dc.contributor.author | Rosmeulen, Maarten | |
dc.date.accessioned | 2022-05-10T08:30:50Z | |
dc.date.available | 2021-11-02T15:58:24Z | |
dc.date.available | 2022-05-10T08:30:50Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 1541-7026 | |
dc.identifier.other | WOS:000672563100044 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37681.2 | |
dc.source | WOS | |
dc.title | Reliability of Mo as Word Line Metal in 3D NAND | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Tierno, Davide | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Ajaykumar, Arjun | |
dc.contributor.imecauthor | Ramesh, Siva | |
dc.contributor.imecauthor | Van den Bosch, Geert | |
dc.contributor.imecauthor | Rosmeulen, Maarten | |
dc.contributor.orcidimec | Tierno, Davide::0000-0003-4915-904X | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | Ramesh, Siva::0000-0002-8473-7258 | |
dc.contributor.orcidimec | Van den Bosch, Geert::0000-0001-9971-6954 | |
dc.contributor.orcidimec | Rosmeulen, Maarten::0000-0002-3663-7439 | |
dc.identifier.doi | 10.1109/IRPS46558.2021.9405132 | |
dc.identifier.eisbn | 978-1-7281-6893-7 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Reliability Physics Symposium (IRPS) | |
dc.source.conferencedate | MAR 21-24, 2021 | |
dc.source.conferencelocation | Monterrey, California | |
dc.source.journal | 2021 IEEE International Reliability Physics Symposium (IRPS) | |
imec.availability | Under review |