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Roles of additive during filling process of damascene structures with electrochemical deposited copper
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Authors
Richard, Emmanuel
;
Vervoort, Iwan
;
Brongersma, Sywert
;
Beyer, Gerald
;
Bender, Hugo
;
Palmans, Roger
;
Lagrange, Sébastien
;
Maex, Karen
Conference
Advanced Metallization Conference; September 28-30, 1999; Orlando, FL, USA.
Title
Roles of additive during filling process of damascene structures with electrochemical deposited copper
Publication type
Oral presentation
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