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3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

dc.contributor.authorSun, Xiao
dc.contributor.authorLin, Hesheng
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorTalmelli, Giacomo
dc.contributor.authorBex, Pieter
dc.contributor.authorSterken, Tom
dc.contributor.authorLauwereins, Rudy
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorMiller, Andy
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2022-01-03T10:39:21Z
dc.date.available2021-11-02T15:59:09Z
dc.date.available2022-01-03T10:39:21Z
dc.date.issued2020
dc.identifier.issn0743-1562
dc.identifier.otherWOS:000668063000033
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37744.2
dc.sourceWOS
dc.title3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorLin, Hesheng
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorTalmelli, Giacomo
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorLauwereins, Rudy
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecLin, Hesheng::0000-0002-7404-3156
dc.contributor.orcidimecTalmelli, Giacomo::0000-0001-7763-7008
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecLauwereins, Rudy::0000-0002-3861-0168
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.eisbn978-1-7281-6460-1
dc.source.numberofpages2
dc.source.peerreviewyes
dc.source.conferenceIEEE Symposium on VLSI Technology and Circuits
dc.source.conferencedateJUN 15-19, 2020
dc.source.conferencelocationHonolulu, HI, USA
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/37744.2*2022-01-03T10:38:18Zvalidation by library/open access desk
120.500.12860/377442021-11-02T15:59:09Z

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