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3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network
dc.contributor.author | Sun, Xiao | |
dc.contributor.author | Lin, Hesheng | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Talmelli, Giacomo | |
dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Sterken, Tom | |
dc.contributor.author | Lauwereins, Rudy | |
dc.contributor.author | Adelmann, Christoph | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-11-02T15:59:09Z | |
dc.date.available | 2021-11-02T15:59:09Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 0743-1562 | |
dc.identifier.other | WOS:000668063000033 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37744 | |
dc.source | WOS | |
dc.title | 3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Sun, Xiao | |
dc.contributor.imecauthor | Lin, Hesheng | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Talmelli, Giacomo | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Sterken, Tom | |
dc.contributor.imecauthor | Lauwereins, Rudy | |
dc.contributor.imecauthor | Adelmann, Christoph | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Adelmann, Christoph::0000-0002-4831-3159 | |
dc.contributor.orcidimec | Lin, Hesheng::0000-0002-7404-3156 | |
dc.contributor.orcidimec | Talmelli, Giacomo::0000-0001-7763-7008 | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Lauwereins, Rudy::0000-0002-3861-0168 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.eisbn | 978-1-7281-6460-1 | |
dc.source.numberofpages | 2 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE Symposium on VLSI Technology and Circuits | |
dc.source.conferencedate | JUN 15-19, 2020 | |
imec.availability | Under review |
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