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Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding
dc.contributor.author | Peng, L. | |
dc.contributor.author | Kim, S. W. | |
dc.contributor.author | Iacovo, S. | |
dc.contributor.author | De Vos, J. | |
dc.contributor.author | Schoenaers, B. | |
dc.contributor.author | Stesmans, A. | |
dc.contributor.author | Afanas'ev, V. V. | |
dc.contributor.author | Miller, A. | |
dc.contributor.author | Beyer, G. | |
dc.contributor.author | Beyne, E. | |
dc.date.accessioned | 2021-11-02T16:01:39Z | |
dc.date.available | 2021-11-02T16:01:39Z | |
dc.date.issued | 2020 | |
dc.identifier.other | WOS:000652345300099 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37918 | |
dc.source | WOS | |
dc.title | Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Peng, L. | |
dc.contributor.imecauthor | Kim, S. W. | |
dc.contributor.imecauthor | Iacovo, S. | |
dc.contributor.imecauthor | De Vos, J. | |
dc.contributor.imecauthor | Miller, A. | |
dc.contributor.imecauthor | Beyer, G. | |
dc.contributor.imecauthor | Beyne, E. | |
dc.contributor.orcidimec | Beyne, E.::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/EPTC50525.2020.9315054 | |
dc.identifier.eisbn | 978-1-7281-8911-6 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 464 | |
dc.source.endpage | 467 | |
dc.source.conference | 22nd IEEE Electronics Packaging Technology Conference (EPTC) | |
dc.source.conferencedate | DEC 02-29, 2020 | |
imec.availability | Under review |
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