Publication:

Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding

Date

2020

Proceedings Paper

https://doi.org/10.1109/eptc50525.2020.9315054

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Author(s)

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Afanas'ev, V. V.

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Journal

na

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Acq. date: 2026-09-16