Publication:
Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding
| dc.contributor.author | Peng, Lan | |
| dc.contributor.author | Kim, Soon-Wook | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Schoenaers, B. | |
| dc.contributor.author | Stesmans, A. | |
| dc.contributor.author | Afanas'ev, V. V. | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Peng, L. | |
| dc.contributor.imecauthor | Kim, S. W. | |
| dc.contributor.imecauthor | Iacovo, S. | |
| dc.contributor.imecauthor | De Vos, J. | |
| dc.contributor.imecauthor | Miller, A. | |
| dc.contributor.imecauthor | Beyer, G. | |
| dc.contributor.imecauthor | Beyne, E. | |
| dc.contributor.imecauthor | Peng, Lan | |
| dc.contributor.imecauthor | Kim, Soon-Wook | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, E.::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2022-01-13T12:54:55Z | |
| dc.date.available | 2021-11-02T16:01:39Z | |
| dc.date.available | 2022-01-13T12:54:55Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1109/EPTC50525.2020.9315054 | |
| dc.identifier.eisbn | 978-1-7281-8911-6 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37918 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 464 | |
| dc.source.conference | 22nd IEEE Electronics Packaging Technology Conference (EPTC) | |
| dc.source.conferencedate | DEC 02-29, 2020 | |
| dc.source.conferencelocation | Singapore | |
| dc.source.endpage | 467 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 4 | |
| dc.title | Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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