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Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding
Publication:
Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding
Date
2020
Proceedings Paper
https://doi.org/10.1109/EPTC50525.2020.9315054
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Peng, Lan
;
Kim, Soon-Wook
;
Iacovo, Serena
;
De Vos, Joeri
;
Schoenaers, B.
;
Stesmans, A.
;
Afanas'ev, V. V.
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
Journal
na
Abstract
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1895
since deposited on 2021-11-02
Acq. date: 2025-10-23
Citations
Metrics
Views
1895
since deposited on 2021-11-02
Acq. date: 2025-10-23
Citations