Publication:

Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding

Date

2020
Proceedings Paper
https://doi.org/10.1109/EPTC50525.2020.9315054
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Author(s)

Peng, Lan  
;
Kim, Soon-Wook  
;
Iacovo, Serena  
;
De Vos, Joeri  
;
Schoenaers, B.
;
Stesmans, A.
;
Afanas'ev, V. V.
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

na

Abstract

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1898 since deposited on 2021-11-02
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Acq. date: 2025-12-08

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