Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL

Abstract

Heterogeneous integration is a cost-effective solution to increase the performance of SoCs by taking advantage of the most appropriate process technology for each functional block that makes up a system. However, to operate efficiently, high bandwidth interconnects are required, and RDL comes as a cost-effective solution. This work shows that this technology can be used to design an interconnect capable of achieving bandwidth densities up to 1Tbps/mm. Moreover, this study shows that the performance of interconnects can be further improved by scaling the microbump pitches and developping new polymers.