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Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL
dc.contributor.author | Pantano, Nicolas | |
dc.contributor.author | Slabbekoom, John | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-11-02T16:03:16Z | |
dc.date.available | 2021-11-02T16:03:16Z | |
dc.date.issued | 2020 | |
dc.identifier.other | WOS:000631824100054 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38042 | |
dc.source | WOS | |
dc.title | Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Pantano, Nicolas | |
dc.contributor.imecauthor | Slabbekoom, John | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.eisbn | 978-1-7281-6293-5 | |
dc.source.numberofpages | 5 | |
dc.source.peerreview | yes | |
dc.source.conference | 8th IEEE Electronics System-Integration Technology Conference (ESTC) | |
dc.source.conferencedate | SEP 15-18, 2020 | |
dc.source.conferencelocation | Vestfold | |
imec.availability | Under review |
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