A flexible power model for mm-wave and THz high-throughput communication systems

Abstract

In order to provide an ever increasing throughput for emerging communication systems, more and more high-frequency bands are being considered, where a wide bandwidth is available, especially at mm-wave (30 to 300 GHz) to THz frequencies. Due to differences in propagation and underlying technology limitations, this leads to systems with different architecture from lower frequencies. In order to estimate the power consumption of such systems and to allow architectural and technology trade-offs, a dedicated power model is proposed. It combines specifically the power consumption of the power amplifier (PA), analog, and digital components. It also includes overhead components such as power supply and the impact of technology scaling towards future CMOS and non-CMOS technologies.

Dedicated models for the different components and their integration in the power model are described. The application of the power model is illustrated on two specific use cases. The first one investigates the trade-off between more antennas or more output power per PA for an access point. Power consumption is optimized for two different PA technologies. The second use case investigates extreme throughputs around 1 Tb/s, targeting fronthaul of future cellular systems. It illustrates the feasibility of such systems from the power consumption point of view.