Notice
This item has not yet been validated by imec staff.
Notice
This is not the latest version of this item. The latest version can be found at: https://imec-publications.be/handle/20.500.12860/38148.2
Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch
dc.contributor.author | Cherman, V | |
dc.contributor.author | Van Huylenbroeck, S. | |
dc.contributor.author | Lofrano, M. | |
dc.contributor.author | Chang, X. | |
dc.contributor.author | Oprins, H. | |
dc.contributor.author | Gonzalez, M. | |
dc.contributor.author | Van der Plas, G. | |
dc.contributor.author | Beyer, G. | |
dc.contributor.author | Rebibis, K. J. | |
dc.contributor.author | Beyne, E. | |
dc.date.accessioned | 2021-11-02T16:04:35Z | |
dc.date.available | 2021-11-02T16:04:35Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000620983200081 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38148 | |
dc.source | WOS | |
dc.title | Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Cherman, V | |
dc.contributor.imecauthor | Van Huylenbroeck, S. | |
dc.contributor.imecauthor | Lofrano, M. | |
dc.contributor.imecauthor | Chang, X. | |
dc.contributor.imecauthor | Oprins, H. | |
dc.contributor.imecauthor | Gonzalez, M. | |
dc.contributor.imecauthor | Van der Plas, G. | |
dc.contributor.imecauthor | Beyer, G. | |
dc.contributor.imecauthor | Rebibis, K. J. | |
dc.contributor.imecauthor | Beyne, E. | |
dc.identifier.doi | 10.1109/ECTC32862.2020.00092 | |
dc.identifier.eisbn | 978-1-7281-6180-8 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 548 | |
dc.source.endpage | 553 | |
dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | JUN 03-30, 2020 | |
imec.availability | Under review |
Files in this item
Files | Size | Format | View |
---|---|---|---|
There are no files associated with this item. |