Publication:

Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00092

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Author(s)

Cherman, Vladimir

;

Van Huylenbroeck, Stefaan

;

Lofrano, Melina

;

;

;

Gonzalez, Mario

;

Van der Plas, Geert

;

;

Rebibis, Kenneth June

;

Journal

na

Metrics

1804 since deposited on 2021-11-02

Acq. date: 2025-12-18