Publication:

Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00092

Simple item page Full metadata Statistics

Author(s)

Cherman, Vladimir

;

Van Huylenbroeck, Stefaan

;

Lofrano, Melina

;

;

;

Gonzalez, Mario

;

Van der Plas, Geert

;

;

Rebibis, Kenneth June

;

Journal

na

Statistics

1813 since deposited on 2021-11-02

1last month

Acq. date: 2026-06-06