Publication:
Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Van Huylenbroeck, Stefaan | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Chang, Xinyue | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Rebibis, Kenneth June | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Cherman, V | |
| dc.contributor.imecauthor | Van Huylenbroeck, S. | |
| dc.contributor.imecauthor | Lofrano, M. | |
| dc.contributor.imecauthor | Chang, X. | |
| dc.contributor.imecauthor | Oprins, H. | |
| dc.contributor.imecauthor | Gonzalez, M. | |
| dc.contributor.imecauthor | Van der Plas, G. | |
| dc.contributor.imecauthor | Beyer, G. | |
| dc.contributor.imecauthor | Rebibis, K. J. | |
| dc.contributor.imecauthor | Beyne, E. | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Chang, Xinyue | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Rebibis, Kenneth June | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
| dc.contributor.orcidimec | Chang, Xinyue::0000-0003-1875-6132 | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-12-16T15:25:00Z | |
| dc.date.available | 2021-11-02T16:04:35Z | |
| dc.date.available | 2021-12-16T15:25:00Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00092 | |
| dc.identifier.eisbn | 978-1-7281-6180-8 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38148 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 548 | |
| dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 03-30, 2020 | |
| dc.source.conferencelocation | Orlando, FL, USA | |
| dc.source.endpage | 553 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 6 | |
| dc.title | Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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