Publication:

Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00092
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Author(s)

Cherman, Vladimir  
;
Van Huylenbroeck, Stefaan  
;
Lofrano, Melina  
;
Chang, Xinyue  
;
Oprins, Herman  
;
Gonzalez, Mario  
;
Van der Plas, Geert  
;
Beyer, Gerald  
;
Rebibis, Kenneth June  
;
Beyne, Eric  

Journal

na

Abstract

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