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Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

dc.contributor.authorKennes, Koen
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBauder, Olga
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorIacovo, Serena
dc.contributor.authorLiu, Xiao
dc.contributor.authorSchmidt, Thomas
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2022-01-13T12:48:19Z
dc.date.available2021-11-02T16:04:36Z
dc.date.available2022-01-13T12:48:19Z
dc.date.issued2020
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000620983200044
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38153.2
dc.sourceWOS
dc.titleIntroduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
dc.typeProceedings paper
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.identifier.doi10.1109/ECTC32862.2020.00056
dc.identifier.eisbn978-1-7281-6180-8
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage296
dc.source.endpage302
dc.source.conference70th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 03-30, 2020
dc.source.conferencelocationOrlando, FL, USA
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/38153.2*2022-01-13T12:47:23Zvalidation by library/open access desk
120.500.12860/381532021-11-02T16:04:36Z

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