Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Abstract

Current roadblocks within the collective die-to-wafer bonding flow, limiting die-transfer yield and throughput, are identified and discussed. Based on the obtained assessment a new carrier system is introduced. The use of the ultra-soft and highly-UV-transparent BrewerBOND (R) C1301 material and its compatibility with BrewerBOND (R) 701 laser release material, which is coated on top of ultra-thin dies, allows for a room temperature, ultra-low force collective bonding with laser-assisted die transfer sequence.