Publication:

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00056
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dc.contributor.authorKennes, Koen
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBauder, Olga
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorIacovo, Serena
dc.contributor.authorLiu, Xiao
dc.contributor.authorSchmidt, Thomas
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.date.accessioned2022-01-13T12:48:19Z
dc.date.available2021-11-02T16:04:36Z
dc.date.available2022-01-13T12:48:19Z
dc.date.issued2020
dc.identifier.doi10.1109/ECTC32862.2020.00056
dc.identifier.eisbn978-1-7281-6180-8
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38153
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage296
dc.source.conference70th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 03-30, 2020
dc.source.conferencelocationOrlando, FL, USA
dc.source.endpage302
dc.source.journalna
dc.source.numberofpages7
dc.title

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

dc.typeProceedings paper
dspace.entity.typePublication
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