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A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking

dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorLofrano, Melina
dc.contributor.authorBeyne, Eric
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-11-02T16:04:37Z
dc.date.available2021-11-02T16:04:37Z
dc.date.issued2020
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000620983200216
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38155
dc.sourceWOS
dc.titleA novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
dc.typeProceedings paper
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidextBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.identifier.doi10.1109/ECTC32862.2020.00228
dc.identifier.eisbn978-1-7281-6180-8
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage1442
dc.source.endpage1447
dc.source.conference70th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 03-30, 2020
imec.availabilityUnder review


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