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Impact of PCB-housing-interaction on QFN solder joint reliability

dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBlansaer, Eddy
dc.date.accessioned2021-11-02T16:04:46Z
dc.date.available2021-11-02T16:04:46Z
dc.date.issued2020
dc.identifier.otherWOS:000618046600047
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38161
dc.sourceWOS
dc.titleImpact of PCB-housing-interaction on QFN solder joint reliability
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.identifier.eisbn978-1-7281-6049-8
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conference21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
dc.source.conferencedateJUL 05-08, 2020
dc.source.conferencelocationCracow
imec.availabilityUnder review


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220.500.12860/38161.22022-01-12T11:02:38Zvalidation by library/open access desk
120.500.12860/38161*2021-11-02T16:04:46Z

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