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Impact of PCB-housing-interaction on QFN solder joint reliability
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Vanderstraeten, Daniel | |
dc.contributor.author | Blansaer, Eddy | |
dc.date.accessioned | 2021-11-02T16:04:46Z | |
dc.date.available | 2021-11-02T16:04:46Z | |
dc.date.issued | 2020 | |
dc.identifier.other | WOS:000618046600047 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38161 | |
dc.source | WOS | |
dc.title | Impact of PCB-housing-interaction on QFN solder joint reliability | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.identifier.eisbn | 978-1-7281-6049-8 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
dc.source.conferencedate | JUL 05-08, 2020 | |
dc.source.conferencelocation | Cracow | |
imec.availability | Under review |
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