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Substrate Interconnect Architecture and IC Design Requirements for an D-Type MCM Active Test Structure

dc.contributor.authorTruzzi, Claudio
dc.contributor.authorPeeters, J.
dc.contributor.authorBeyne, Eric
dc.contributor.authorChiadò Piat, A.
dc.contributor.authorSartori, M.
dc.date.accessioned2021-09-29T12:49:03Z
dc.date.available2021-09-29T12:49:03Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/381
dc.sourceIIOimport
dc.titleSubstrate Interconnect Architecture and IC Design Requirements for an D-Type MCM Active Test Structure
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.source.peerreviewno
dc.source.beginpage219
dc.source.endpage226
dc.source.conferenceProceedings of the International Conference on Electronic Technologies; June 6-8, 1994; Windsor, UK.
imec.availabilityPublished - imec


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