dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Zahedmanesh, Houman | |
dc.contributor.author | Gonzalez, Mario | |
dc.date.accessioned | 2021-11-26T11:24:53Z | |
dc.date.available | 2021-11-02T16:06:49Z | |
dc.date.available | 2021-11-26T11:24:53Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 0026-2714 | |
dc.identifier.other | WOS:000601148900013 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38310.2 | |
dc.source | WOS | |
dc.title | Mechanical stability of airgaps in nano-interconnects | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vanstreels, K. | |
dc.contributor.imecauthor | Zahedmanesh, H. | |
dc.contributor.imecauthor | Gonzalez, M. | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Zahedmanesh, Houman | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
dc.identifier.doi | 10.1016/j.microrel.2020.113597 | |
dc.source.numberofpages | 8 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 113597 | |
dc.source.journal | MICROELECTRONICS RELIABILITY | |
dc.source.issue | na | |
dc.source.volume | 107 | |
imec.availability | Published - imec | |