Show simple item record

Influence of the As and BF2 junction implantation on the stress induced defects during the Ti- and Co/Ti-silicidation

dc.contributor.authorSteegen, An
dc.contributor.authorBender, Hugo
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T11:40:52Z
dc.date.available2021-10-14T11:40:52Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3851
dc.sourceIIOimport
dc.titleInfluence of the As and BF2 junction implantation on the stress induced defects during the Ti- and Co/Ti-silicidation
dc.typeProceedings paper
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage15
dc.source.endpage22
dc.source.conferenceAdvanced Interconnects and Contacts
dc.source.conferencedate5/04/1999
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 564


Files in this item

Thumbnail
Name:
3820.pdf
Size:
638.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record