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Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium

dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorPuliyalil, Harinarayanan
dc.contributor.authorVersluijs, Janko
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorBaert, Rogier
dc.contributor.authorPaolillo, Sara
dc.contributor.authorDecoster, Stefan
dc.contributor.authorSchleicher, Filip
dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorBekaert, Joost
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLorant, Christophe
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorCiofi, Ivan
dc.contributor.authorBriggs, Basoene
dc.contributor.authorHeijlen, Jeroen
dc.contributor.authorDupas, Luc
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorVancoille, Eric
dc.contributor.authorWebers, Tomas
dc.contributor.authorVats, Hemant
dc.contributor.authorRynders, Luc
dc.contributor.authorCupak, Miroslav
dc.contributor.authorLee, Jae Uk
dc.contributor.authorDrissi, Youssef
dc.contributor.authorHalipre, Luc
dc.contributor.authorCharley, Anne-Laure
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorWitters, Thomas
dc.contributor.authorVan Gompel, Sander
dc.contributor.authorKimura, Yosuke
dc.contributor.authorDemonie, Ingrid
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorErcken, Monique
dc.contributor.authorKim, Ryan Ryoung han
dc.contributor.authorTrivkovic, Darko
dc.contributor.authorCroes, Kristof
dc.contributor.authorLeray, Philippe
dc.contributor.authorJaysankar, Manoj
dc.contributor.authorWilson, Chris
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-12-16T14:17:58Z
dc.date.available2021-12-06T02:06:16Z
dc.date.available2021-12-16T14:15:40Z
dc.date.available2021-12-16T14:17:58Z
dc.date.issued2020
dc.identifier.issn2380-9248
dc.identifier.otherWOS:000717011600197
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38538.3
dc.sourceWOS
dc.titleSupervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
dc.typeProceedings paper
dc.contributor.imecauthorVega-Gonzalez, V.
dc.contributor.imecauthorPuliyalil, H.
dc.contributor.imecauthorVersluijs, J.
dc.contributor.imecauthorLesniewska, A.
dc.contributor.imecauthorVarela-Pereira, O.
dc.contributor.imecauthorBaert, R.
dc.contributor.imecauthorPaolillo, S.
dc.contributor.imecauthorDecoster, S.
dc.contributor.imecauthorSchleicher, F.
dc.contributor.imecauthorMontero, D.
dc.contributor.imecauthorBekaert, J.
dc.contributor.imecauthorKesters, E.
dc.contributor.imecauthorLe, Q. T.
dc.contributor.imecauthorLorant, C.
dc.contributor.imecauthorTeugels, L.
dc.contributor.imecauthorHeylen, N.
dc.contributor.imecauthorJourdan, N.
dc.contributor.imecauthorEl-Mekki, Z.
dc.contributor.imecauthorvan der Veen, M.
dc.contributor.imecauthorCiofi, I
dc.contributor.imecauthorBriggs, B.
dc.contributor.imecauthorHeijlen, J.
dc.contributor.imecauthorDupas, L.
dc.contributor.imecauthorDe-Wachter, B.
dc.contributor.imecauthorVancoille, E.
dc.contributor.imecauthorWebers, T.
dc.contributor.imecauthorVats, H.
dc.contributor.imecauthorRynders, L.
dc.contributor.imecauthorCupak, M.
dc.contributor.imecauthorUk-Lee, J.
dc.contributor.imecauthorDrissi, Y.
dc.contributor.imecauthorHalipre, L.
dc.contributor.imecauthorCharley, A-L
dc.contributor.imecauthorVerdonck, P.
dc.contributor.imecauthorWitters, T.
dc.contributor.imecauthorGompel, S., V
dc.contributor.imecauthorKimura, Y.
dc.contributor.imecauthorDemonie, I
dc.contributor.imecauthorLazzarino, F.
dc.contributor.imecauthorErcken, M.
dc.contributor.imecauthorKim, R.
dc.contributor.imecauthorTrivkovic, D.
dc.contributor.imecauthorCroes, K.
dc.contributor.imecauthorLeray, P.
dc.contributor.imecauthorJaysankar, M.
dc.contributor.imecauthorWilson, C.
dc.contributor.imecauthorMuroch, G.
dc.contributor.imecauthorTokei, Z.
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorPuliyalil, Harinarayanan
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorSchleicher, Filip
dc.contributor.imecauthorMontero Alvarez, Daniel
dc.contributor.imecauthorBekaert, Joost
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLorant, Christophe
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorHeijlen, Jeroen
dc.contributor.imecauthorDupas, Luc
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorVancoille, Eric
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorVats, Hemant
dc.contributor.imecauthorRynders, Luc
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorLee, Jae Uk
dc.contributor.imecauthorDrissi, Youssef
dc.contributor.imecauthorHalipre, Luc
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorVan Gompel, Sander
dc.contributor.imecauthorKimura, Yosuke
dc.contributor.imecauthorDemonie, Ingrid
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorKim, Ryan Ryoung han
dc.contributor.imecauthorTrivkovic, Darko
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorJaysankar, Manoj
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecPuliyalil, Harinarayanan::0000-0002-9749-5307
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecSchleicher, Filip::0000-0003-3630-7285
dc.contributor.orcidimecMontero Alvarez, Daniel::0000-0001-9966-0399
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecLee, Jae Uk::0000-0002-9434-5055
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.identifier.doi10.1109/IEDM13553.2020.9372096
dc.identifier.eisbn978-1-7281-8888-1
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 12-18, 2020
dc.source.conferencelocationSan Francisco, CA, USA
dc.source.journalna
imec.availabilityPublished - imec


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320.500.12860/38538.3*2021-12-16T14:17:12Zvalidation by library/open access desk
220.500.12860/38538.22021-12-16T13:55:53Zvalidation by library/open access desk
120.500.12860/385382021-12-06T02:06:16Z

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