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Improved hot-carrier reliability in a 0.5-µm TLM CMOS process by back-end process optimization

dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorDeferm, Ludo
dc.contributor.authorForester, Lynn
dc.contributor.authorCollins, Tom
dc.date.accessioned2021-09-29T12:49:15Z
dc.date.available2021-09-29T12:49:15Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/385
dc.sourceIIOimport
dc.titleImproved hot-carrier reliability in a 0.5-µm TLM CMOS process by back-end process optimization
dc.typeProceedings paper
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorDeferm, Ludo
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage303
dc.source.endpage306
dc.source.conference24th European Solid State Device Research Conference - ESSDERC
dc.source.conferencedate11/09/1994
dc.source.conferencelocationEdinburgh UK
imec.availabilityPublished - imec


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