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Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions

dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorGomes, W.
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T11:42:44Z
dc.date.available2021-10-14T11:42:44Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3875
dc.sourceIIOimport
dc.titleElectrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions
dc.typeOral presentation
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.source.peerreviewno
dc.source.conferenceMRS Spring Meeting Symposium on Ultraclean Processing of Semiconductor Structures and Devices; April 1999
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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